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PC3H2 Series
PC3H2 Series
4-channel package type is also available. (model No. PC3Q62)
Mini-flat Half Pitch Package, High CMR Photocoupler
Description
PC3H2 Series contains a IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat, Half pitch type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter voltage is 80V(*), CTR is 20% to 400% at input current of 1mA and CMR is MIN. 10kV/s.
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC3H2) 2. Package resin : UL flammability grade (94V-0)
Applications
1. Programmable controllers
Features
1. 4-pin Mini-flat Half pitch package (Lead pitch : 1.27mm) 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 80V()) 4. High noise immunity due to high common mode rejection voltage (CMR : MIN. 10kV/s) 5. Isolation voltage between input and output (Viso(rms) : 2.5kV)
(*) Up to Date code "P9" (September 2002) VCEO : 70V.
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A01101EN Date Sep. 30. 2003 (c) SHARP Corporation
PC3H2 Series Internal Connection Diagram
1
1 4
2 3
2
3
4
Anode Cathode Emitter Collector
Outline Dimensions
Rank mark SHARP mark "S" Anode mark 2.60.3
1
(Unit : mm)
Date code
S 3H2
4.4
0.2
4
2
3
1.270.25
5.30.3 (1.7) 0.20.05 2.00.2 Epoxy resin
7.0+0.2 -0.7
*( ): Reference dimensions Product mass : approx. 0.05g
0.10.1
0.5+0.4 -0.2
0.40.1
Sheet No.: D2-A01101EN
2
PC3H2 Series Date code (2 digit)
1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M * * N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Mark P R S T U V W X A B C * * *
repeats in a 20 year cycle
Country of origin
Japan
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A01101EN
3
PC3H2 Series
Absolute Maximum Ratings
Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Topr Operating temperature Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 *4 80 6 50 150 170 -30 to +100 -40 to +125 2.5 260 (Ta=25C) Unit mA A V mW V V mA mW mW C C kV C
*1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s *4 Up to Date code "P9" (September 2002) VCEO : 70V.
Electro-optical Characteristics
Parameter Symbol Forward voltage VF IR Reverse current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance tr Rise time Response time Fall time tf Common mode rejection voltage CMR
Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=1mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz
Output
Input
Input
Output
Transfer characteristics
VCE=2V, IC=2mA, RL=100 Ta=25C, RL=470, VCM=1.5kV(peak) IF=0, VCC=9V, Vnp=100mV
MIN. - - - - *5 80 6 0.2 - 5x1010 - - - 10
TYP. 1.2 - 30 - - - - 0.1 1x1011 0.6 4 3 -
MAX. 1.4 10 250 100 - - 4.0 0.2 - 1.0 18 18 -
(Ta=25C) Unit V A pF nA V V mA V pF s s kV/s
*5 Up to Date code "P9" (September 2002) BVCEO70V.
Sheet No.: D2-A01101EN
4
PC3H2 Series
Model Line-up
Package Taping 3 000pcs/reel PC3H2 PC3H2A PC3H2B PC3H2C PC3H2D PC3H2AB PC3H2BC PC3H2CD PC3H2AC PC3H2BD PC3H2AD Rank mark with or without A B C D A or B B or C C or D A, B or C B, C or D A, B, C or D IC [mA] (IF=1mA, VCE=5V, Ta=25C) 0.2 to 4.0 0.35 to 0.7 0.5 to 1.0 0.8 to 1.6 1.2 to 2.4 0.35 to 1.0 0.5 to 1.6 0.8 to 2.4 0.35 to 1.6 0.5 to 2.4 0.35 to 2.4
Model No.
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A01101EN
5
PC3H2 Series Fig.1 Test Circuit for Common Mode Rejection Voltage
(dV/dt)
VCM RL Vnp VCC VCM : High wave pulse RL=470 VCC=9V VO (Vcp Nearly = dV/dtxCfxRL) 1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side. 1) Vcp Vnp
VCM
Fig.2 Forward Current vs. Ambient Temperature
50
Fig.3 Diode Power Dissipation vs. Ambient Temperature
100 Diode power dissipation P (mW)
Forward current IF (mA)
40
80 70 60
30
20
40
10 0 -30
20 0 -30
0
25
50 55
75
100
125
0
25
50 55
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.4 Collector Power Dissipation vs. Ambient Temperature
250 Collector power dissipation PC (mW)
Fig.5 Total Power Dissipation vs. Ambient Temperature
250
200
Total power dissipation Ptot (mW)
0 25 50 75 100 125
200 170 150
150
100
100
50
50
0 -30
0 -30
0
25
50
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Sheet No.: D2-A01101EN
6
PC3H2 Series Fig.6 Peak Forward Current vs. Duty Ratio
2 000 1 000 500 200 100 50 20
1
Fig.7 Forward Current vs. Forward Voltage
500 200
Pulse width100s Ta=25C Forward current IF (mA)
Ta=75C
50C 25C 0C
Peak forward current IFM (mA)
100 50 20 10 5 2
-25C
10
5
10-3 2
5 10
-2
2
5 10
-2
2
5
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Duty ratio
Forward voltage VF (V)
Fig.8 Current Transfer Ratio vs. Forward Current
300 VCE=5V Ta=25C 200
Fig.9 Collector Current vs. Collector-emitter Voltage
50 PC (max) 40 Collector current IC (mA) Ta=25C
Current transfer ratio CTR (%)
30
IF=30mA 20mA
20
100
10mA
10
5mA 1mA 0 2 4 6 8 10
0 1 10 Forward current IF (mA) 100
0
Collector-emitter voltage VCE (V)
Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature
150 IF=1mA VCE=5V
Fig.11 Collector - emitter Saturation Voltage vs. Ambient Temperature
0.20 0.18 0.16 Collector-emitter saturation voltage VCE (sat) (V) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 IF=20mA IC=1mA
Relative current transfer ratio (%)
100
50
0 -40
-20
0
20
40
60
80
100
0.00 -40
-20
0
20
40
60
80
100
Ambient temperature Ta (C)
Ambient temperaturet Ta (C)
Sheet No.: D2-A01101EN
7
PC3H2 Series Fig.12 Collector Dark Current vs. Ambient Temperature
10-4 VCE=50V Collector dark current ICEO (A) 10-5 Response time (s) 10.0
Fig.13 Response Time vs. Load Resistance
100.0 VCE=2V IC=2mA Ta=25C tf tr td ts
10-6
10-7
1.0
10-8 10-9 -40
-20
0
20
40
60
80
100
0.1 0.1
1 Load resistance RL (k)
10
Ambient temperature Ta (C)
Fig.14 Test Circuit for Response Time
VCC RD Input VCE td tr ts tf 90% RL Output Input 10%
Fig.15 Frequency Response
VCE=5V IC=2mA Ta=25C 0 Voltage gain AV (dB)
Output
RL=10k -10
1k
100
Please refer to the conditions in Fig.13
-20 0.1
1
10 Frequency f (kHz)
100
1 000
Fig.16 Collector-emitter Saturation Voltage vs. Forward Current
5 IC=0.5mA Collector-emitter saturation voltage VCE (sat) (V) 4 1mA 3mA 5mA 3 7mA Ta=25C
2
1
0 0 3 6 9 12 15 Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A01101EN
8
PC3H2 Series Design Considerations Design guide
While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED. This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration.
Recommended Foot Print (reference)
6.3
1.27
1.5
0.8
(Unit : mm)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A01101EN
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PC3H2 Series
Manufacturing Guidelines Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
(C) 300
Terminal : 260C peak ( package surface : 250C peak)
200
Reflow 220C or more, 60s or less 100 Preheat 150 to 180C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A01101EN
10
PC3H2 Series Cleaning instructions Solvent cleaning:
Solvent temperature should be 45C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A01101EN
11
PC3H2 Series Package specification Tape and Reel package Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions
F
E
D
G I C
J
B H A H L K
Dimensions List A B 12.00.3 5.50.1 H I 0.1 7.5 0.30.05
C 1.750.1 J 2.30.1
D 8.00.1 K 3.10.1
E 2.00.1 L +0.1 1.6-0
(Unit : mm) F G +0.1 4.00.1 1.5-0
Reel structure and Dimensions
e g c d
f a b
Dimensions List a b 330 13.51.5 e f 1.0 23 2.00.5
5
MAX
.
(Unit : mm) c d 1001.0 130.5 g 2.00.5
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A01101EN
12
PC3H2 Series Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
Sheet No.: D2-A01101EN
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